...
Focus on O-DU integration and security tests.
Status
...
- Ongoing installation of O-CU.ODU integration is the top priority. O-DU-Low and O-DU High Integration (G Rel.) is with Intel and Radisys are ongoing.Currently,
- Installation of Radisys O-DU integration is the top priorityCU Binary is ongoing.
- VIAVI TM500 Lite is and RIC Test are ready to use.
Access
Access is limited, and resource sharing is not yet available.
For lab access, please send an e-mail to the lab contact, ; provide , your name, email, business affiliation if any, and reason for access. This is often in relation to an OSC project (Projects) and therefore is facilitated through the Project Technical Lead (PTL).
Contact: Professor Ray-Guang Cheng, National Taiwan University of Science and Technology (NTUST)
Email: crg@gappscrg@mail.ntust.edu.tw
Diagram
Lab 1 - NTUST Lab
...
The integration of O-DU Low (FlexRAN 21.11) and O-DU High in Rel. G is ongoing.
O-CU
The installation of commercial O-CU provided by Radysis is ongoingOpenAirInterface (OAI) CU is done.
Partial integration of OSC O-DU High with and OAI CU is done.
The installation of commercial O-CU provided by Radysis is ongoing.
Near-RT RIC
The Rel. F Near-RT RIC is currently deployed in an OpenStack environment.
The Rel. F Near-RT RIC can connect to Viavi VIAVI RIC Test (v. 1.5).
5G Core
free5GC by NYCU, Taiwan, is tested.
SABox by Nokia Lab., France, is used.
Software Simulators
Viavi VIAVI TeraVM RIC Tester v. 1.5 , is used as the RAN simulator for emulating the E2 Nodes for Near-RT RIC integration test.
...
Viavi TM500 is provided in NTUST Lab. (TM500 Lite), ChungHwa Telecom (CHT) Lab., and Auray Lab. for O-DU testing (the same as that used in OSC New Jersey Lab.)
...
UpiSpace Fronthaul Gateway is used.
Foxconn Indoor Foxconn Indoor O-RU (RPQN-7801, 3.7-3.8GHz 4T4R).